Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity

ABSTRACT

A polysilicon sensor is described which can be incorporated onto a silicon wafer containing integrated circuits for the purpose of detecting and monitoring electromigration(EM) in metal test stripes representative of the interconnection metallurgy used by the integrated circuits. The sensor capitalizes on the property of silicon whereby a small increase in temperature causes a large increase in carrier concentration. In this regard, the local temperature rise of an adjacent metal line undergoing EM failure manifests itself as a decrease in resistance of the sensor. The sensor is particularly suited for testing multi-level metallurgies such as those having an aluminum alloy sandwiched between metallic layers such as those used for diffusion barriers and anti-reflective coatings. Its fabrication is compatible with conventional MOSFET processes which use a self-aligned polysilicon gate. It can be particularly useful when built into the wafer kerf area or into a manufacturing test site(MTS) where it can be used to qualify the metallization of a particular job. Structures built into the wafer kerf can be tested immediately after metallization while those built into MTS chips can be reserved for long term reliability testing.

This is a division of patent application Ser. No. 08/796,351, filingdate Feb. 7, 1997 U.S. Pat. No. 5,846,818, A Polysilcon ElectromigrationSensor Which Can Detect And Monitor Electromigration In Composite MetalLines On Integrated Circuit Structures With Improved Sensitivity,assigned to the same assignee as the present invention.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

This invention relates to processes for the manufacture of semiconductordevices and more particularly to a polysilicon test structure which canbe used to detect and monitor the onset of electromigration in metallines characteristic of integrated circuit interconnection metallurgy.The structure can be used for basic studies or it can be incorporatedinto a specially designed integrated circuit test chip and used as ahighly sensitive line monitor.

(2) Description of prior art

The fabrication of integrated circuit chips involves the embedding ofintegrated circuit devices into a polished silicon wafer. The processesbasically consist of device processing-wherein the semiconductor devicesand field isolation regions are formed within the silicon surface, anddevice personalization wherein the wafer receives two or more levels ofinterconnection metallurgy, separated by insulation. The first layer ofmetallization is used to define small fundamental circuits, for example,a simple CMOS inverter containing two complimentary MOS field effecttransistors(MOSFETs). Additional layers of metal lines are then providedto interconnect these primary circuits into larger units. A final layerof metallization is applied to connect the circuits to pads which formthe chip's external connections. Connections between metal levels aremade using metal filled via holes within an insulation layer.

Electromigration is a failure mechanism of these metal lines that hastroubled integrated circuit technology since it's very beginnings in the1960s. The earliest circuit devices were immense, compared to theirpresent sizes. Similarly, the dimensions of the metal lines used tointerconnect these devices were also much larger than they are today.The currents which these metal lines were required to carry oftenexceeded 1×10⁵ amps/cm². In the bipolar technology of that day it wasthe emitter current that reached such levels. Failure of the emitterstripe, which was made of pure aluminum, began to occur after many hoursof temperature/humidity testing. Metal within the stripe was physicallyswept along the stripe by the strong electron current in what was calledthe "electron wind". As the metal was swept away, sections of the stripebecame thinner. This resulted in an increase in current density in thatregion accompanied by a local rise in temperature which further hastenedthe failure. The results of the accelerated life testing were laterconfirmed by emitter stripe failures in the field at longer timeintervals. Statistical analysis of these results confirmed that thefailures were truly a weakness of the aluminum metallurgy itself. Thephenomenon was called electromigration(EM). The fix for the problem camequickly. The pure aluminum metallurgy was replaced with alloys ofaluminum containing small amounts of silicon, copper, titanium, ortungsten. These alloys exhibited various degrees of inhibition of themetal drift.

Fortunately, as devices became smaller, operating voltages decreasedsomewhat and the current densities were kept in check with theassistance of better cooling. However, long term failure due toelectromigration is still a major concern. In todays CMOS technology itis the power line current that causes electromigration failure exposure.The surface topology of the wafer has also become a concern with regardto metal line failures. Deposition of metal lines is commonly done bysputtering the metal from an aluminum alloy target. The presence ofsurface topological features in the areas where metal lines aredeposited results in inadequate metal coverage. These features are oftendifficult to avoid. Metal lines frequently must traverse areas ofunderlying oxide field isolation regions which have ridges along theiredges. Also lines crossing other lines on lower levels encounter dipsand rises in topology. Local thinning of the metal lines over thesefeatures provide the weak spots for electromigration failures.

Consequently, various test structures have been designed to detect andmonitor electromigration in susceptible circuits. One such structure,referred to by Chesire and Oates U.S. Pat. No. 5,264,377, is termed"SWEATS" (Standard Wafer-level Electromigration Acceleration Test). Thisstructure is of the four-point-probe design(two pads for currentapplication and two pads for voltage measurement) and consists of ametal stripe with multiple narrow regions (See FIG. 1). Testing is doneby passing a larger than normal current (in excess of 1×10⁷ amp/cm²through the stripe while measuring the voltage drop along it. The narrowsections quickly rise in temperature providing the heat to acceleratethe test without harming the surrounding structures on the wafer. Thetest is quick and can be done as a spot check during wafer processing.Unfortunately the rapidity with which it is performed and theuncertainty of temperature, only allows it to be used as a spot check.Consequently correlation with long term stress testing is lacking.Chesire and Oates described a structure similar to the SWEATS structurebut without the wide and narrow regions. It consists of a straight metalstripe, again with the fourpoint-probe feature, but also with additionalmetallization alongside the stripe to detect shorts, as well astransverse lines representing typical topography beneath the teststripe. This structure was basically designed for process monitoringpurposes with quick turn-around times. It is driven by applied currentsin excess of 1×10⁷ amp/cm², and can give timely information for processadjustments within minutes. The design features more gradual temperaturegradients, closer approximation to actual metallization geometries, andbetter correlation with long-term accelerated tests.

Recent advances in metal interconnection systems required by the trendtowards miniaturization have made electromigration failure monitoringeven more complex. The aluminum alloy lines are being fitted withadjacent thin layers of refractory metals and bimetallics consisting oftitanium(Ti), titanium nitride(TiN), titanium-tungsten alloy(TiW), toname a few. These materials serve as diffusion barriers, adhesionpromoters, anti-reflection coatings(ARC), and in other capacities thatserve to improve bonding, lower contact resistance, and in general,improve the integrity of the overall interconnection system. For thepurpose of this discussion, these layers will be referred to as barrierlayers. The barrier layers can occur at one or both interfaces of thealuminum alloy. The aluminum alloy is still the primary current carrierbut the adjacent barrier layers also participate in the process. Thetesting procedures which concern these composite metal lines must nowalso include these barrier layers. When electromigration occurs in sucha structure, the barrier layers remain intact and the aluminum alloy,which is sandwiched between them fails. The standard methods andstructures which measure the resistivity of the failing line becomeimpractical because no sudden increase in resistivity occurs when theline fails.

This invention describes an electromigration sensor which is locatedadjacent to a composite EM test line and measures the local heatingproduced by the electromigration in the aluminum alloy.

SUMMARY OF THE INVENTION

The method for monitoring electromigration provided by this inventiondoes not measure the metal line directly, but instead utilizes apolysilicon sensor element placed under the line, separated from it by alayer of silicon oxide. The polysilicon sensor is highly sensitive tothermal hot spots in the metal line. The sensor utilizes a property ofsilicon called the intrinsic region, wherein a small increase intemperature causes a large increase in carrier concentration. FIG. 2depicts this temperature region occurring above about 3500C for siliconwith a dopant concentration of 1×10¹⁵ atoms/cm³ (from S.M.Sze, "Physicsof Semiconductor Devices", Wiley, N.Y. (1969),p.36). In this regard, alocal increase in temperature of an adjacent metal line undergoingelectromigration failure, manifests itself as a decrease in resistanceof the sensor. In order to make effective use of the intrinsic property,undoped(less than 1×10¹⁴ atoms/cm²) polysilicon must be used for thesensor.

Fabrication of the sensor is compatible with current CMOS manufacturingprocesses utilizing self-aligned polysilicon gates. The sensor can bebuilt into the wafer kerf area and tested prior to dicing or in can bebuilt into a chip called a manufacturing test site(MTS). The MTS chipcontains metal lines compatible with the sensor and fabricated at thesame time as those of the product. In the photomask set, several MTSchips are placed within the array of product chips. Herein the sensorsare deposited in the same step as the polysilicon gate. In this processsensors are provided only for test metal lines contained at the firstmetallization level. However, these lines are generally the smallest andthe most susceptible to electromigration failure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of a prior art structure used for measuringelectromigration known as the SWEATS structure.

FIG. 2 is a graphical representation of electron density versus theinverse of absolute temperature for silicon.

FIG. 3 is a top view of the electromigration structure of the presentinvention along with a schematic representation of the probes andtesting circuitry.

FIG. 4 is a cross sectioned isometric representation of the structureusing deposited metal contacts to the intrinsic polysilicon sensorstripe. Both probe pads for the sensor and one for the EM test stripeare shown.

FIG. 5 through 11 are cross sections showing the fabrication of apolysilicon electromigration sensor and it's EM test metal stripe withinthe framework of process steps conventionally used for the formation ofself-aligned polysilicon gate MOSFETs.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to FIG. 3, there is shown a typical embodiment of thisinvention in schematic form along with its measurement circuitry. Themetal stripe 400 undergoing EM testing is connected between probe pads401 and 402. Current is supplied to the stripe by power supply 420. Thesensor 14, which lies below the EM metal stripe 400, and is insulatedfrom it by a layer of silicon oxide, consists of a stripe of polysiliconhaving heavily doped lateral edges. Composite aluminum metallization isapplied to the edges and forms an electrical connection between thestripe and the measurement probe contacts 414 and 415. The measurementprobes are connected to instrumentation 421 which measures theresistance of the polysilicon sensor. For additional clarification ofthe structure, refer to FIG. 4 which is an isometric view with across-section of a portion of the sensor and the EM test stripe. Thesilicon oxide layer 12 on the silicon wafer 10 is the field oxideisolation used in the CMOS process. The polysilicon sensor stripe 14consists of a central intrinsic portion 14a and heavily doped edgeportions 14b.

The silicon oxide layer 16 which isolates the metal stripe 400 from thepolysilicon sensor stripe 14 is derived from the oxide layer 16 whichdefines the contacts for the CMOS devices. The EM test stripe 400structure consists of the barrier metallurgy 18a the aluminum/siliconalloy 18b and an anti-reflection coating of Ti, TiW, or TiN 18cdeposited onto the stripe. The metallization which forms the lateralconnections to the polysilicon sensor 14 and the probe contacts 414 and415 is formed in the same process step as the metallization for the EMtest stripe 400 and its probe contacts 401 and 402(the latter is notshown in FIG. 4).

FIG. 5 through FIG. 10, illustrate the fabrication process by which thisembodiment is formed within the framework of a conventional self-alignedpolysilicon gate CMOS manufacturing process. The cross section depictedin these figures is the same as that represented in FIG. 4.

Referring now to FIG. 5, a substrate consisting of a p-type <100>oriented mono-crystalline silicon wafer 10 is provided. The wafer 10contains CMOS devices formed within its surface which are enclosed byareas of silicon oxide field isolation 12. This embodiment is fabricatedover such an area of field oxide 12. This area may be located in thewafer kerf or in a special manufacturing test site(MTS). A layer ofintrinsic polycrystalline silicon(hereafter referred to aspolysilicon)14 is then deposited usinglow-pressure-chemical-vapor-deposition between 600° and 650° C. insilane and hydrogen to a thickness between 1500 to 5000 Angstroms. Thisis the identical deposition used to form the gate electrodes for theproduct devices.

The next step requires a photoresist mask PRI to protect the activeportion of the polysilicon sensor from ion implantation. Masking someareas of the polysilicon from the gate implant is not common to all CMOSprocesses although it is implemented in someSRAM(Static-Random-Access-Memory) procedures. Thus, this could beconsidered as an additional photolithographic step for the EM sensorfabrication.

Using standard photolithographic techniques, the polysilicon layer ispatterned to define a stripe between 1 to 4 microns wide and up to10,000 microns long. The thickness of the polysilicon stripe isconsistent with the thickness of the polysilicon gate used in theproduct and can be between 0.1 to 1 microns thick. FIG. 6 illustratesthis photoresist mask PRI in position, defining the center intrinsicportion of the polysilicon stripe 14a.

The gate ion implant is next performed using arsenic or phosphorous andthe photoresist mask PRl is stripped in the conventional manner. Asecond layer of photoresist is applied and patterned to form the maskPR2. This mask defines the polysilicon gate of the product and also theentire polysilicon portion of the EM sensor FIG. 7. The exposedpolysilicon is then etched away using reactive-ionetching(RIE) withchlorine/argon, leaving the stripe 14 which consists of the centralintrinsic portion 14a and the doped edges 14b as depicted in FIG. 8.This step also forms the polysilicon gate structures of the product.

The CMOS processing continues with the p-channel source/drain implantswhile the n-channel devices are protected by photoresist. Then then-channel devices are next implanted while the p-channel devices areprotected by photoresist. The polysilicon EM sensor structure isshielded from these implants by photoresist. In some processes a siliconoxide sidewall is provided alongside the polysilicon gate prior tosource/drain implant. The polysilicon sensor would also receive thissidewall but it would have no impact on its functionality.

Referring now to FIG. 9, a layer of silicon oxide 16 is deposited usingLPCVD. This is the layer which will contain the contact openings for thesilicon devices and at the same time provide the insulation between thepolysilicon EM sensor and the EM metal test stripe. In some processes itmay be comprised of phosphosilicate glass(PSG) or of borophosphosilicateglass(BPSG). A layer of photoresist PR3 is deposited over silicon oxidelayer 16 and patterned to define the access openings for the devicecontacts as well as expose the edges of the polysilicon EM sensor. Theseopenings are then formed by reactive-ion-etching of the silicon oxidelayer 16 using tetrafluoromethane(CF₄).

The metallization is next deposited by sputtering. The barriermetallurgy, consisting of a titanium layer followed by a titaniumnitride layer, is deposited first. Then an aluminum/silicon/copper alloyis deposited. Finally a thin layer of Ti, TiW, or TiN is deposited overthe aluminum alloy as an anti-reflection coating. These depositions areperformed in a multi-target sputtering system so that the entirecomposite metallization is formed in a single pumpdown, thereby avoidingneedless exposure to atmosphere. A layer of photoresist PR4 is appliedand patterned over the metallization layer, and the metallization layeris etched by reactive-ion-etching to form the metallization for thedevices, the contact to the polysilicon EM sensor, and theelectromigration test stripe 400 itself (FIG. 11 and FIG. 4).

The metal stripe may now be tested for electromigration failure byapplying probes to the probe pads 401, 402, 414 and 415. A fixed voltageis applied between pads 401 and 402 to provide a current consistent withpredetermined stress conditions for the EM test stripe. The circuitry421 then monitors the current vs time using a recording device.

The testing regimen depends upon the nature and severity of theelectromigration exposure. Testing of EM stripes in the wafer kerf couldbe done at this point to determine if the wafer is to be scrapped orre-directed. Test specimens located on MTSs can be reserved forsubsequent accelerated testing after the wafer is diced. In order toaccomplish the later or to perform kerf testing at a later point in theprocess, the connections from the pads 401, 402, 414, and 415 must bepropagated along the metallization hierarchy through vias to make themavailable for probing at the appropriate time.

The preceding embodiment was for a basic stand-alone EM test structure.Its compatibility with widely used conventional processes for themanufacture of products in the MOSFET family, in particular CMOS, makesit extremely useful as a process monitor. This compatibility ispresently confined only to the first layer of metallization, although itis this layer where electromigration concerns are most prevalent. ThisEM test structure is able to detect electromigration failure of thealuminum alloy stripe in the presence of non-failing adjacent barriermetallization. The failure is obscured when direct testing of the metalstripe is used under these conditions. Test devices fabricated onto MTSscan be useful for reliability and parametric studies of productmetallurgies.

The embodiments of FIGS. 4 through 11 used a P-substrate. It should bewell understood by those skilled in the art that N-type substrateconductivities may also be used. It should be further understood thatthe substrate conductivity type as referred to here does not necessarilyrefer to the conductivity of the starting wafer but could also be theconductivity of a diffused region within a wafer.

While the invention has been particularly shown and described withreference to the preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade without departing from the spirit and scope of the invention.

What is claimed is:
 1. A structure formed on a silicon wafer substrateto detect the onset and monitor the progress of electromigration in anadjacent metal test line, comprising:(a) a wafer substrate having afirst insulative layer; (b) a polysilicon stripe, formed on said firstinsulative layer, having an intrinsic band disposed centrally betweentwo impurity doped conductive bands, said conductive bands disposedlaterally along the length of said intrinsic band: (c) two metal bands,each one of said two metal bands having an attached probe pad andcontacting, respectively, one of said two conductive bands along itsfull length: and (d) a metal stripe, having probe pads at each end, andhaving a central portion between said probe pads comprising a test line,disposed over and aligned in the same direction as said polysiliconstripe and insulated therefrom by a second insulative layer.
 2. Thestructure of claim 1 wherein said metal stripe is up to 10,000 micronslong between probe pads, between 0.1 and 2.0 microns wide and between0.1 and 1.0 microns thick.
 3. The structure of claim 1 wherein saidpolysilicon stripe is between about 1 and 2 microns wider than saidmetal stripe.
 4. The structure of claim 1 wherein the resistivity ofsaid intrinsic band is no less than 100 ohm cm. at 25° C.
 5. Thestructure of claim 1 wherein the first insulating layer is a field oxideisolation layer and is between 3000 and 5000 Angstroms thick.
 6. Thestructure of claim 5 wherein the metal stripe comprises a first layer oftitanium, a second layer of titanium nitride, a third layer of analuminum-silicon-copper alloy and a fourth layer selected from the groupconsisting of titanium, titanium-tungsten alloy, and titanium nitride.7. The structure of claim 1 wherein said second insulating layer issilicon oxide and is between 6000 and 10,000 Angstroms thick.
 8. Thestructure of claim 1 wherein the second insulating layer is aphosphosilicate glass and is between 6000 and 10,000 Angstroms thick. 9.The structure of claim 1 wherein the second insulating layer is aborophosphosilicate glass and is between 6000 and 10,000 Angstromsthick.
 10. The structure of claim 1 wherein the metal stripe is analuminum-silicon-copper alloy.
 11. The structure of claim 1 wherein themetal stripe comprises a first layer of titanium, a second layer oftitanium nitride, and a third layer of an aluminum silicon-copper alloy.